| COTS Project |
Report Title |
Comments |
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Junction Temperature Restriction due to Plastic Packaging October 15, 2007 |
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Assessment of Glass Transition Temperature Impact on Mechanical Properties of Mold Compounds used for PEMs October 15, 2007 |
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The Significance of Glass Transition Temperature of Molding Compounds for Screening and Reliability. Qualification of COTS PEMs |
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Typical Plastic Parts Flow Rev. K September 5, 2008 |
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Assessment of PEM Life Test Data - November 7, 2007 |
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Assessment of Impact of Flame Retardants on Mold Compound Reliability |
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Handling Moisture Sensitive Components Analysis of Baking Schedules |
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Manufacturing with PEMs - Technical Problems and a Recommended Solution for JPL |
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| Extreme Environments |
Low Temperature Testing for 26C-32, October 23, 2000, 19 pp |
|
| Analog-to-Digital Converters |
Analog-to-Digital Converter Parts Evaluation for Space Applications, October 31, 1997, 19 pp |
Limited Access Document |
| Known-Good-Die |
Known Good Die: Facilitating Multi-Chip Modules, April 29, 1994, 42 pp |
|
| Low Power Savings |
Low Voltage (3.3v) Performance Assessment of UTMC Standard (5v), July 29, 1996, 33 pp |
|
| Reliability Assessment |
Methodology and Criteria for Risk Assessment of Commerical Off-The_Shelf (COTS) Parts, May 5, 1997, 55 pp |
|
| Plastic Encapsulated Microcircuits |
Plastic Parts Delamination Validation Using Failure Analysis Methods, March 6, 1998, 12 pp |
Limited Access Document |
| Plastic Encapsulated Microcircuits |
Part Construction Analysis Report for Intel 16 MB Flash Memory,
October 14, 1997, 15 pp |
|
| Plastic Encapsulated Microcircuits |
Total Dose Radiation Test Report for Intel 16 MB Flash Memory,
October 14, 1997, 27 pp |
|
| Plastic Encapsulated Microcircuits |
Acoustic Microscopy Report for Plastic Encapsulated Microcircuits,
September 11, 1997, 11 pp |
|
| Plastic Encapsulated Microcircuits |
Chemical Analysis and Outgassing of Plastic Packaged Parts, April 22, 1997, 17 pp |
|
| Known-Good-Die |
Known-Good-Die Assurance for MCMS in Space Application,
April 13, 1998, 3 pp |
|
| Plastic Encapsulated Microcircuits |
Burn-In Results for Intel Flash Memory in Plastic Package, January 20, 1997,
25 pp |
|
| Reliability Assessment |
Assessment of DRAM Reliability from Retention Time Measurements,
June 1998
20 pp |
|
