2001 MRQW Technical Program Proceedings

More presentations will be added as they are received.

Day 1 - Tuesday, 12/11/2001

Keynote

Advanced Microprocessor Technologies and Challenges for Space Applications (Abstract) - Nadim Haddad, BAE Systems

Session 1 --- Advance Memory Reliability
Chair: Leif Scheick/JPL

Ferroelectric Memory Reliability and Qualification (Abstract) - Gary Derbenwick, Celis

Reliability Qualification of 0.25 um SOS process (Abstract) - Ron Reedy, Peregrine Semiconductor

Advanced Memories for Space Application (Abstract) - John Rodgers, BAE Systems

Session 2 --- FPGA Reliability
Chairs: Ramin Roosta/JPL

Reliability of Antifuse-Based FPGAs for Military and Aerospace Applications (Abstract) - John McCollum, Actel

Proton Testing of SEU Mitigation Methods for the Virtex FPGA (Abstract) - Carl Carmichael, Xilinx

A FPGA Qualification Methodology (Abstract) - Robert McInturff, Raytheon

The Application of PEM FPGAs in Space (Abstract) - Joseph Fabula, Xilinx

Session 3 --- DC/DC Converter Reliability
Chairs: Gary Bivins/JPL

Design-in Reliability for Space DC/DC Converters (Abstract) - Richard Miller, Advanced Analog/M-3

Qualifying DC/DC Converters for the Space Environment (Abstract) - Steve Canzano, Crane/Interpoint

Space Application of VPT Hybrid DC/DC Converters (Abstract) - Dan Sable, VPT, Inc.

Session 4 --- Radiation Effects
Chairs: Allan Johnston/JPL

New Strategies for Radiation Hard Electronics (Abstract) - Ron LaCoe, Aerospace Corp.

Cure-alls or Just Lesser Evils? Epi, Thinned and SOI Substrates (Abstract) - Paul Dodd, Sandia National Labs

Space Qualification of Hardened by Design ASICs (Abstract) - Dave Alexander, MRC

Day 2 - Wednesday, 12/12/2001

Keynote

The Tyranny of the Roadmap: New CMOS Gate Dielectrics with Reliability Promises and Challenges (Abstract)
- George Brown, Sematech

Session 5 --- Advanced Technologies Reliability
Chairs: Ron LaCoe/The Aerospace Corp

Degradation and Breakdown of Ultra-thin Silicon Dioxide by Electron and Hole Injection (Abstract) - Eric Vogel, NIST

SOI Materials and CMOS Technology at IBM (Abstract) - Devendra Sadana, IBM

Impact of System Design Trends on Advanced Packaging Technology (Abstract) - James Anderson, MIT/LL

Session 6 --- MEMS Reliability
Chair: Joanne Wellman/JPL

Testing and Characterization of Resonant and Nonlinear MEMS (Abstract) - Kim Turner, UCSB

MEMS Reliability Methods and Results (Abstract) - Danelle Tanner, Sandia National Labs

Reliability and Quality Assurance Issues and Methods for Commercial MEMS (Abstract) - Gisela Lin, Standard MEMS

Session 7 --- COTS Qualification Methods
Chairs: Richard Kemski/JPL

Prediction of PEMs and SMT components performance in Field Applications (Abstract) - Jim Sweet, Sandia

Rapid Qualification of COTS/PEMs by Impedence Spectroscopy (Abstract) - Jesse Lumsden, Rockwell Scientific

Session 8 – COTS/PEMS Reliability
Chairs: Wayne Bosze/JPL

Industry Sharing of COTS/PEMs Reliability/Qualification Data (Abstract) - Jim McDonald, US Army

An Approach for Providing Pre-tested COTS (Abstract) - William Davis, Applied Materials Technology

Increasing Reliability Using Open Systems Architecture (Abstract) - Dale Waldo, Boeing