Office of Safety and Mission Success Component Engineering & Assurance Office 514


September, 2009

Jose Pantaleon is new GIDEP Coordinator

September 24th, 2009

Jose Pantaleon has taken on the role of GIDEP Coordinator.  GIDEP stands for (Government-Industry Data Exchange Program)and  is a cooperative activity between government and industry participants seeking to reduce or eliminate expenditures of resources by sharing technical information essential during research, design, development, production and operational phases of the life cycle of systems, facilities and […]

Doug Sheldon presented 2 papers at the 2009 MAPLD (Military and Aerospace Programmable Logic Devices)

September 17th, 2009

Doug Sheldon presented 2 papers at the 2009 MAPLD (Military and Aerospace Programmable Logic Devices) meeting at Goddard Space Flight Center. The first paper was titled “FPGAs, Scaling and Reliability”. This was a discussion of the CMOS process technology used to scale modern FPGAs down to 45nm. The talk also highlighted reliability related devices physics […]

DO-254 to JPL?

September 15th, 2009

DO-254 is a standard for “Design Assurance Guidance for Airborne Electronic Hardware” The DO-254 standard is a means of compliance for the design of complex electronic hardware in airborne systems. Complex electronic hardware includes devices like Field Programmable Gate Arrays (FPGAs), Programmable Logic Devices (PLDs), and Application Specific Integrated Circuits (ASICs). The DO-254 standard is […]

Q1 2009 Foundry Rankings

September 14th, 2009

Here is the Q1 2009 ranking for foundries.  Note that TSMC is almost 4X larger in revenue than the next company, UMC at #2.

BAE lists 4Mb CRAM memory

September 14th, 2009

Rad hard nonvolatile memory in the form a 2 and 4Mb CRAM is coming closer and closer to reality.  BAE Systems currently shows the devices on their web site.  514 is investigating these memories from both a reliability as well as radiation performance point of view.

X-Fab launches high-temperature CMOS process

September 14th, 2009

This is a press release dated 9/11/09. X-Fab is large former East German based company that specializes in mixed signal and analog processes.  This new press release mentions a 0.35um CMOS process that is capable of operating at temperatures of up to 175C.  The maximum temperature is listed at 185C.  Its a single poly, triple […]