Office of Safety and Mission Success Component Engineering & Assurance Office 514

Search

November, 2014

Dr. Jean Yang-Scharlotta Presented at the 2013 IEEE International Integrated Reliability Workshop (IIRW)

November 5th, 2014

Dr. Jean Yang-Scharlotta attended the  2013 IEEE International Integrated Reliability Workshop (IIRW) at Fallen Leaf Lake California where she showed results from the resistive memory study entitled “Reliablity Characterization of a Commerical TaOx-based ReRAM.  The refereed paper was co-authored by Mark White, Doug Sheldon, Megan Fazio and Mehran Ambar, and will be available for download […]

Doug Sheldon visited i3 Electronics Technology in Endicott, New York

November 3rd, 2014

The OSMS Heterogeneous Packaging R&TD team (Doug Sheldon of Electronic Parts Engineering and Don Hunter, Don Schatzel, Peter Dillon, Jong-ook Suh, Fernando Aguirre and Greg Davis of ESD) visited i3 Electronics Technology in Endicott, New York to review the company’s advanced packaging technology capabilities.  The R&TD team is partnering with i3 to develop miniaturized versions […]

Shri Agarwal Participated in the JAXA-organized 27th Microelectronics Workshop in Tsukuba, Japan

November 3rd, 2014

Shri Agarwal participated in the JAXA-organized 27th Microelectronics Workshop in Tsukuba, Japan and gave an invited paper titled NASA’s Approach to Space Parts Miniaturization. The presentation was co-authored by Michael Sampson of GSFC.

Lori Risse Represented JPL at the Society of Women Engineers Career Fair

November 3rd, 2014

Lori Risse represented JPL at the Society of Women Engineers Career Fair on October 24.  Students and professionals interested in a career at JPL had a chance to speak with JPL employees and submit their resumes.