Office of Safety and Mission Success Component Engineering & Assurance Office 514


John Puckett and Shri Agarwal Participated in Solid State Devices Meetings Held in Savannah, GA

John Puckett and Shri Agarwal (Electronic Parts Engineering) participated in Solid State Devices meetings held in Savannah, GA. There was discussion on counterfeit parts mitigation, use of new materials (Copper and Silver) as substitute for gold bond wires in plastic microcircuits, adaption of silicon carbide discrete devices, certification of Class Y products, insertion of submicron technologies in microcircuit standards, etc. In addition, as its newly appointed Vice Chair, Shri attended the Executive Committee meeting which discussed ways to develop solutions to current technical problems in the application, standardization, and reliability of solid state devices.

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