Office of Safety and Mission Success Component Engineering & Assurance Office 514

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Shri Agarwal Participated in the Defense Logistics Agency Audit of Flip Chip International

December 10th, 2014

Shri Agarwal participated in the Defense Logistics Agency audit of Flip Chip International, FCI. Located in Phoenix, Arizona, FCI is a leading provider of wafer bumping foundry services. They are a critical link in the supply chain for space products offered by Aeroflex, Honeywell and other major microcircuit manufacturers.

Dr. Jean Yang-Scharlotta Presented at the 2013 IEEE International Integrated Reliability Workshop (IIRW)

November 5th, 2014

Dr. Jean Yang-Scharlotta attended the  2013 IEEE International Integrated Reliability Workshop (IIRW) at Fallen Leaf Lake California where she showed results from the resistive memory study entitled “Reliablity Characterization of a Commerical TaOx-based ReRAM.  The refereed paper was co-authored by Mark White, Doug Sheldon, Megan Fazio and Mehran Ambar, and will be available for download […]

Doug Sheldon visited i3 Electronics Technology in Endicott, New York

November 3rd, 2014

The OSMS Heterogeneous Packaging R&TD team (Doug Sheldon of Electronic Parts Engineering and Don Hunter, Don Schatzel, Peter Dillon, Jong-ook Suh, Fernando Aguirre and Greg Davis of ESD) visited i3 Electronics Technology in Endicott, New York to review the company’s advanced packaging technology capabilities.  The R&TD team is partnering with i3 to develop miniaturized versions […]

Shri Agarwal Participated in the JAXA-organized 27th Microelectronics Workshop in Tsukuba, Japan

November 3rd, 2014

Shri Agarwal participated in the JAXA-organized 27th Microelectronics Workshop in Tsukuba, Japan and gave an invited paper titled NASA’s Approach to Space Parts Miniaturization. The presentation was co-authored by Michael Sampson of GSFC.

Chet Everline, Doug Sheldon, Jeffery Nunes, and Harald Schone Hosted the System Level Implications of Using COTS in Class B Spacecraft Workshop

October 10th, 2014

Chet Everline, Doug Sheldon, Jeffery Nunes, and Harald Schone hosted the System Level Implications of Using COTS in Class B Spacecraft Workshop as a follow-up to the COTS EEE Parts for Class B Missions Workshop held in July.  The workshop objective was to review the key risk drivers (both mission risks and implementation risks) stemming from the use […]

Doug Sheldon, Steve Guertin, Steve McClure, Leif Scheick, and Shri Agarwal Participated in the 2014 EEE Parts for Small Missions Workshop at Goddard Space Flight Center

October 10th, 2014

Doug Sheldon, Steve Guertin, Steve McClure, Leif Scheick and Shri Agarwal participated in the 2014 EEE Parts for Small Missions Workshop at Goddard Space Flight Center.  The workshop had over 150 attendees discussing a wide range of issues regarding electronic parts and the use in small missions.  Doug Sheldon presented a talk entitled “CubeSat Parts Database: […]

Doug Sheldon, Chuck Barnes, Reza Ghaffarian, Peter Dillon, Jong-ook Suh, and Don Hunter Met with a Team from Boeing Satellite Development Center

October 10th, 2014

Doug Sheldon, Chuck Barnes, Reza Ghaffarian, Peter Dillon, Jong-ook Suh, and Don Hunter from JPL OSMS and ESD met with a team from Boeing Satellite Development Center to discuss the use of plastic ball grid array (PBGA) packages with large, high pin count and high power silicon devices like FPGAs and rad hard application-specific integrated […]

Doug Sheldon, Shri Agarwal, and Chuck Barnes Reviewed the Next Generation High Column Density FPGA Package Offering in a Telecon with Microsemi and Representatives from Goddard Space Flight Center

October 10th, 2014

Doug Sheldon, Shri Agarwal and Chuck Barnes reviewed the next generation high column density (1,657 columns) FPGA package offering in a telecon with vendor Microsemi and representatives from Goddard Space Flight Center.  Microsemi plans to introduce this Column Grid Array (CGA) 1657 package with their next generation RTG4 flash based FPGA devices.  The CGA1657 package […]

Doug Sheldon, Steve Guertin, Steve McClure, and Leif Scheick Participated in the 2014 EEE Parts for Small Missions Workshop at Goddard Space Flight Center

September 29th, 2014

Doug Sheldon, Steve Guertin, Steve McClure, Leif Scheick (Electronic Parts Engineering) and Shri Agarwal (Assurance Technology Program) participated in the 2014 EEE Parts for Small Missions Workshop at Goddard Space Flight Center.  The workshop was attended by over 150 participants discussing a wide range of issues regarding electronic parts and their use in small missions.  Doug […]

Doug Sheldon Hosted a Presentation from Professor Shuki Bruck of Caltech Entitled “Reliable and Scalable Solutions for Space-Grade Flash Storage”

August 11th, 2014

Doug Sheldon hosted a presentation from Professor Shuki Bruck of Caltech.  Professor Bruck’s presentation was entitled “Reliable and Scalable Solutions for Space-Grade Flash Storage”.  Professor Bruck’s presentation described a multi-tiered approach to provide JPL with a high density (~100GB) solid state drive that will be able to be with withstand high radiation and long term […]