Nondestructive Evaluation (NDE) is a term used for various techniques which shed valuable insight into the properties of an article, generally without causing damage.

Typical techniques employed include C-Mode Scanning Acoustic Microscopy (CSAM), Real-Time & Computed Tomography X-ray, & Ultrasonic Testing.

C-Mode Scanning Acoustic Microscopy (CSAM) is extremely useful for identifying air gaps, delamination, cracks, porosity, density changes in materials & characterizing bondlines.  This is accomplished by sending an ultrasonic signal from a transducer through a liquid media and analyzing the reflected echoes.

Specialized Capability:

• Sonoscan Gen 6
• Transducer frequencies from 5 MHz to 300 MHz
• Range of focal lengths to suit varying thicknesses
• Rotational capability for cylindrical samples

Real-Time X-ray enables live radiographic inspection and image acquisition up to 160kV.  This technique can be deployed in minutes and allows quick triaging of failures.

Specialized Capability: 

• YXLON Feinfocus 160kV

X-ray Computed tomography (CT) system collects thousands of X-ray images at different angles and computer processes them into a singular 3D volume.  The resulting volume enables a myriad of customizable analyses and inspection techniques, including dimensional characterization of hidden structures, virtual cross sections, and selective material visualization as a few examples.

Specialized Capability:

• Customized Northstar 5000         
• 450kV up to 3mA
• 20-225kV, 50-3000uA
• Directional and Transmission configurations
• Perkin Elmer XRD 1621, 200 micron pitch, <450kV
• Varian Paxscan 2520DX, 127 micron pitch, <225kV
• 4D CT capable of adding motion to 3D volume

Parts screening describes a group of tests designed to screen or upscreen components, directed by source control drawing, specialist or Cog-E.  Typical screening includes tests such as particle impact noise detection (PIND), fine and gross leak hermeticity, real-time X-ray and visual inspection.

Particle Impact Noise Detection system vibrates the device under test while listening for signatures of loose particles bouncing within a cavity.

Specialized Capability:

• B&W D4000

Hermeticity testing is divided into two categories, fine and gross leak.  Fine leak subjects the device to pressurized helium under specific time and pressure conditions, followed by helium leak detector characterization using a mass spectrometer.  Gross leak uses fluorinert and pressurized helium to enable visualization of bubbles in the case of a leaker.

Real-time X-ray inspection enables live radiographic inspection and image acquisition up to 160kV.  This technique can be deployed in minutes and allows quick triaging of failures.

Specialized Capability: 

• YXLON Feinfocus 160kV

External Visual Inspection consists of a optical microscopic examination to identify noncompliance with requirements.

Specialized Capability:

• Keyence 5000
• Extensive macro & compound microscope selection

Failure analysis (FA) is the process of collecting and analyzing data to determine the cause of a failure. The objective of a failure analysis is to understand root cause, thus enabling implementation of corrective actions which prevent failure re-occurrence.

Failure analysis requires a multidisciplinary approach utilizing many specialized laboratory tools and techniques to successfully convert a failing device into a defect image.

Photon Emission Microscopy (PEM) is executed using a deep depletion CCD detector to characterize emitted photon locations on a failing device. 

Modulation Mode Infrared Imaging (MMIR) applies a frequency to the device power and captures IR images with a Ln2 cooled InSb detector at different power states, enabling a significant increase in sensitivity over conventional IR imaging.

Externally Induced Voltage Alteration (XIVA) rasters a 1340nm thermal laser over a failing device, while precisely monitoring voltage and current for changes, enabling isolation of leakage failures.

Time Domain Reflectometry (TDR) introduces a pulse onto a conductor and measures the time delay for the pulse reflection, enabling length calculation.

Electrical testing of a wide variety of electronic printed wiring boards, components, cables or  connectors.  Testing can be customized to evaluate device performance parameters or verify conformance to a requirement.

Specialized Capability:

• Keysight B1500
• Eureka DDR2400 tester

Destructive physical analysis is a series of tests applied to microelectronic devices ensuring each lot meets requirments for flight use.  Typically, the testing is performed as part of an up-screening effort and performed per MIL-STD-1580 and applicapable documents.

External Visual Inspection consists of a optical microscopic examination to identify noncompliances with requirements.

Specialized Capability:

• Keyence 5000
• Extensive macro & compound microscope selection

Particle Impact Noise Detection system vibrates the device under test while listening for signatures of loose particles bouncing within a cavity.

Specialized Capability:

• B&W D4000

Hermeticity testing is divided into two categories, fine and gross leak.  Fine leak subjects the device to pressurized helium under specific time and pressure conditions, followed by helium leak detector characterization using a mass spectrometer.  Gross leak uses fluorinert and pressurized helium to enable visualization of bubbles in the case of a leaker.

Real-time X-ray inspection enables live radiographic inspection and image acquisition up to 160kV.  This technique can be deployed in minutes and allows quick triaging of failures.

Specialized Capability: 

• YXLON Feinfocus 160kV

Physical Characterization is a group of techniques used to inspect or assess physical properties of an article or feature of interest.  Types of support provided include high resolution optical visual inspections, dimensional characterization including 3D topography mapping, chemical and mechanical decapsulation, and expert cross-sectioning capability.

Specialized Capability: 

• Keyence VR3000 3D topography mapping
• FALIT laser decapsulation and ablation
• Jiaco microwave induced plasma decapsulation system
• Allied Techcut 5 precision wafering saw
• MultiPrep precision cross sectioning system
• Ultratec ASAP 1 micro milling tool
• Well stocked wet chemistry laboratory
• DAGE 4000 die shear / wire pull

Scanning electron microscope (SEM) enables high magnification inspection of features too small for optical microscopy.  Beyond visualization, additional information such as material characteristics, identification and topography can be gleaned using the variety of available detectors.

Our dual beam focused ion beam (FIB) system combines the high-resolution imaging capabilities of a scanning electron microscope (SEM) with the precision milling and circuit edit functions of a focused ion beam (FIB).  This enables insitu cross sectioning and slice by slice imaging through a feature of interest with nanometer resolution.

Specialized Capability: 

• Zeiss Auriga w/ platinum, carbon and dielectric deposition
• LEO VP Supra 50 SEM
• IXRF EDS system

Parts construction analysis is a workflow similar to reverse engineering designed to document and provide insight into device construction.

The Extreme Temperature Qualification Laboratory (ETQL) qualifies electronic components & packaging designs, mechanical designs, bonded joint designs, assemblies, and other design elements to the thermal life cycling requirements of JPL wide projects.

The ETQL is literally one of the coolest places at JPL, able to emulate mission environments down to 10 Kelvin ❄️. Simultaneously it’s also one of the hottest places, with environments reaching temperatures over 500˚ Celsius ☀️. Capabilities include atmospheric and vacuum thermal cycling, thermal shock, highly accelerated life testing (HALT), and humidity testing.

Specialized Capability: 

• Atmospheric thermal chambers using LN2 (-195°C to +500°C)
• Cryostat down to 10K
• Highly Accelerated Life Testing (HALT) (-160°C to +200°C)
• Vacuum thermal chambers
• Temperature / Humidity chambers